Through-hole board and FPC board transfer device
Holes in ceramic substrates and FPC substrates can be transferred non-contact regardless of the position of the holes.
1. Through-hole perforated boards and film substrates are suction-compatible. 2. Suction is possible regardless of the size of the substrate or the position of the holes. 3. Stacked substrates are suctioned one by one. 4. No need to change the setup of the suction device. 5. Does not leave scratches or dirt marks on the pads.
- 企業：ソーラーリサーチ研究所 大阪事業所
- 価格：100,000 yen-500,000 yen
